Quality & Manufacturing

Overview of our manufacturing partners, quality management systems, and device-level QA/QC.

Quality management

• Documented quality management system aligned to ISO 9001 practices; environmental controls aligned to ISO 14001.
• Controlled BOM and revision management (ECR/ECN), with change notices per our Lifecycle & PCN.
• Supplier qualification and periodic audits; material certifications retained (RoHS/REACH).

Build standards

• Workmanship to IPC‑A‑610 (class appropriate for the product and use case).
• ESD controls per ANSI/ESD S20.20 and moisture sensitivity handling per JEDEC J‑STD‑033.
• Storage, bake, and handling procedures for MSL components; stencil and reflow profiles under document control.

Inspection and test

• Incoming quality control (IQC), in‑process AOI, and X‑ray inspection where applicable (e.g., BGA).
• Electrical verification (ICT where applicable) and 100% functional test before pack‑out.
• Calibrated test equipment with periodic verification (traceable where applicable).

Subsystem verification

• Power: input ranges, regulators, brownout behavior, and protection circuits.
• Processing: MCU/SoC boot, clocks, memory, and secure elements where applicable.
• Interfaces: USB/UART/SPI/I2C/GPIO exercised via automated fixtures.
• Sensing/IO: attached sensors and indicators validated against expected ranges.
• Connectivity: radio front‑end paths and antenna ports verified per RF QA/QC below.

RF QA/QC

• Per‑device RF test against documented limits (e.g., conducted power, sensitivity, spectral masks as applicable).
• Use of a characterized reference device ("golden unit") to verify test fixtures and compensate drift.
• Retention of test results with device identifier, firmware version, and timestamp.

Nonconformance and CAPA

• Documented NCR process with containment, root‑cause, and corrective/preventive actions (CAPA).
• Sampling plans (e.g., AQL) used for incoming/outgoing inspections as appropriate.
• Rework/repair tracked against serialization with retest before release.

Serialization and traceability

• Per‑device serialization (e.g., 2D code/QR) linked to lot, key components, test results, and firmware build.
• Traveler and pack‑out records retained per internal retention policy.

Environmental and reliability

• Design and verification to the product’s intended operating range; see Operating & Environmental Specs.
• Optional stress or burn‑in based on product risk assessment.

Materials and compliance

• RoHS and materials compliance; see Environmental & Materials Compliance.
• Conflict minerals and human‑rights commitments; see Human Rights Policy.

Firmware & software quality

• Version‑controlled builds with automated unit/integration tests and static analysis where applicable.
• Secure firmware delivery: signing/verification, staged rollouts, and safe rollback strategy.
• OTA update policy documented; release notes and compatibility guidance maintained.
• SBOM available on request; vulnerability intake and remediation aligned with our Security policy.
• Backward compatibility: semantic versioning and deprecation windows to preserve existing integrations.
• Future‑proofing: maintain stability for wire protocols, storage schemas, and public APIs.
• Compatibility testing matrix across supported hardware revisions and prior firmware branches.
• Configuration/data migrations included in releases; safe rollback paths validated in pre‑release testing.
• LTS release tracks receive critical fixes without requiring major feature upgrades.